发明名称 ETCHING METHOD FOR THIN SHEET
摘要 PROBLEM TO BE SOLVED: To provide a technique for performing a masking with a resist without breaking a brittle thin sheet containing rare-earth metal elements. SOLUTION: An adhesive sheet 11a(11b) pattern-forming as a desirable shape and loosing tacky adhesive power by heating to a prescribed temperature is stuck onto a zone as the etching objective in the thin sheet 12. Successively, the resist R in a zone as non-etching objective in the thin sheet 12 is disposed. Then, after detaching the tacky adhesive sheet 11a(11b) stuck onto the thin sheet 12 from the thin sheet 12 by heating to the prescribed temperature, the etching is applied to the thin sheet 12 disposed with the resist R. The tacky adhesive sheet 11a(11b) can be detached from the thin sheet 12 without giving excess stress in the brittle thin sheet 12 by using the tacky adhesive sheet 11a(11b) loosing the adhesion by heating the prescribed temperature as the masking with the resist R. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005089783(A) 申请公布日期 2005.04.07
申请号 JP20030321585 申请日期 2003.09.12
申请人 TDK CORP 发明人 MIKI NOBUYUKI;UMEHARA NAOMICHI
分类号 C23F1/08;(IPC1-7):C23F1/08 主分类号 C23F1/08
代理机构 代理人
主权项
地址