SURFACE TREATMENT METHOD FOR PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To promote high-density wiring packaging for a printed circuit board by improving affinity on the surface of a polyimide film. SOLUTION: The printed circuit board in which at least a surface layer is composed of the polyimide film is exposed to ozone gas of 3 to 50 vol% at an ambient temperature from room temperature to 200°C and the surface of the polyimide film is chemically surface-modified so that affinity is improved. It is preferable that the ambient temperature is room temperature to 60°C, the concentration of the ozone gas is 15 to 30 vol%, and the chemical surface modification is performed at normal atmospheric pressure. COPYRIGHT: (C)2005,JPO&NCIPI