| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic substrate unit which can require a less number of parts, facilitate its assembling work, have a low cost, and naturally compatible with dimensional change of an electronic substrate. SOLUTION: The unit comprises a circuit board 4 having electronic components 3 mounted thereon, a heat sink plate 5 made of a metallic material laminated on the lower surface of the circuit board 4, and a polymer thermoplastic resin 6 filled in outer peripheral sides of the circuit board 4 and the heat sink plate 5 to cover the outer peripheries of the circuit board 4 and the heat sink plate 5. COPYRIGHT: (C)2005,JPO&NCIPI
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