发明名称 THERMAL TREATMENT EQUIPMENT, THERMAL TREATMENT METHOD, AND SUBSTRATE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide thermal treatment equipment, a thermal treatment method, and a substrate treating device by which the heat accumulation in the holding section of a substrate transporting means can be suppressed with a simple structure without lowering the throughput of substrate treatment. SOLUTION: In a thermal treatment unit PHP, a substrate W is transported between a receiving/delivering section 201 and a heating section 202 in a state where the substrate W is held by a local transport hand RHR and the substrate W is heat-treated by means of the heating section 202. In addition, the local transport hand RHR is cooled by means of the cooling plate 250 of the receiving/delivering section 201. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005093727(A) 申请公布日期 2005.04.07
申请号 JP20030325113 申请日期 2003.09.17
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 FUKUMOTO YASUHIRO;MASUDA MITSUHIRO;AZUMA TORU
分类号 H01L21/677;F27B17/00;F27D3/00;F27D5/00;F27D11/00;H01L21/00;H01L21/027;H01L21/68;(IPC1-7):H01L21/027 主分类号 H01L21/677
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