| 摘要 |
PROBLEM TO BE SOLVED: To provide a superior semiconductor cooling unit which has an excellent heat dissipation efficiency and has a high profile precision. SOLUTION: The semiconductor cooling unit 1 comprises semiconductor modules 10 each including semiconductor elements 11, and flat cooling tubes 20 each having a hollow part 21 for a cooling medium to flow therein. Each semiconductor module 10 includes two electrode plates 15 which are so located as to face each other with the semiconductor element 11 in between. The cooling tube 20 is joined to each electrode plate 15 via an insulating layer 30 having an electric insulating property. At least either one of the sides between the electrode plates 15 and the insulating layer 30 and between the insulating layer 30 and the cooling tube 20 are joined using an adhesive. COPYRIGHT: (C)2005,JPO&NCIPI
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