| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation circuit board for radiating heat of a circuit board on which circuit components are mounted, and also to provide a method of manufacturing the same, assuring low cost, excellent heat radiating property and productivity. SOLUTION: The heat radiating circuit board is formed of a double-layer structure of a metal plate 103 and an insulating layer 102. The insulating layer is formed of a mixture of an inorganic filler and a thermosetting resin composition. A concave area is provided to the surface side opposing to the metal plate side of the insulating layer corresponding to the external shapes of a plurality of circuit components 105 mounted to the circuit board 104. Since the heat radiating circuit board 101A can surely be placed in contact with the ceiling surface of each circuit component with higher accuracy, the heat generated from circuit components can be radiated efficiently through the heat radiating circuit board. COPYRIGHT: (C)2005,JPO&NCIPI
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