| 摘要 |
A ball-grid-array (BGA) package and a printed circuit board for supporting the package comprise a chip mounted on a first surface of a substrate, a plurality of power/ground solder balls disposed on a second surface of the substrate and next to the bottom of the chip, and a plurality of signal solder balls disposed on the second surface of the substrate and adjacent to the power/ground solder balls. Wherein, the power/ground solder balls are located between the chip and the signal solder balls. |
