发明名称 DRESSING METHOD AND MANUFACTURING DEVICE OF POLISHING PAD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of quantitatively detecting the end point of optimum dressing by non-destructive pad evaluation method. <P>SOLUTION: A polishing pad 11 is dressed during predetermined time (step 50), and then the surface roughness (unevenness) of the polishing pad 11 is measured by an optical measuring device 20 composed of a laser focus displacement meter (step 51), thereby obtaining a characteristic curve of the dressing time and the surface roughness of the polishing pad 11 (step 52). Subsequently, the inclination of the characteristic curve of the dressing time and the surface roughness is obtained (step 53), and when the inclination reaches a preset designated inclination, dressing is ended. On the other hand, while the inclination of the characteristic curve of the dressing time and the surface roughness does not reach the designated inclination, the operation in the steps 53 to 53 is repeatedly performed (step 54). <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005088128(A) 申请公布日期 2005.04.07
申请号 JP20030324898 申请日期 2003.09.17
申请人 SANYO ELECTRIC CO LTD;ROHM CO LTD 发明人 FUJISHIMA TATSUYA;SAMEJIMA KATSUMI
分类号 B24B53/00;B24B49/12;B24B53/007;B24B53/017;B24B53/02;H01L21/304 主分类号 B24B53/00
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