| 摘要 |
PROBLEM TO BE SOLVED: To provide slurry for cutting a silicon ingot, which can reduce cutting resistance in the cutting of the silicon ingot. SOLUTION: In the slurry for cutting the silicon ingot, which contains an abrasive grain and a basic substance such as a sodium hydroxide, the content of the basic substance is set at least at 3.5 mass%, preferably, 4.0-30 mass% based on the mass of the whole liquid component in the slurry; and a pH of the slurry is set at 12 or more. The slurry is used in a range of 65-95°C. COPYRIGHT: (C)2005,JPO&NCIPI |
