发明名称 SEMICONDUCTOR MODULE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor module whose switching element will not receive damage due to the electromagnetic effect generated between the switching element and a control wiring or the like, in the semiconductor module comprising the switching element, the control wiring or the like. SOLUTION: The semiconductor module 100 is equipped with semiconductor-switching elements 1a, 1b, main electrodes 3a, 3b, 3c, control wires 4a, 4b and control cathode wires 5a, 5b. In the semiconductor module 100, the control wires 4a, 4b and the control cathode wires 5a, 5b are respectively provided with a part substantially parallel to the arranging direction of a main electrode. Further, the semiconductor module is provided with a wiring structure, wherein one of the wires, in which a current in the same direction as the main current is conducted to flow through one part among the control wires 4a, 4b and the control cathode wires 5a, 5b when the semiconductor-switching elements 1a, 1b are turned on, is arranged nearer to the main electrodes 3a, 3b, 3c than to the other wires. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005093756(A) 申请公布日期 2005.04.07
申请号 JP20030325757 申请日期 2003.09.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 USUI OSAMU;NAKATAKE HIROSHI;OI TAKESHI;CHIKAI SATOSHI;MIZOJIRI TETSUO
分类号 H01L25/07;H01L21/60;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L25/07
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