| 摘要 |
PROBLEM TO BE SOLVED: To enable suppression of flowing of an adhesive layer during lamination of multiple layers, prevention of an interlayer shift, acquisition of a high lamination accuracy, and acquisition of an electric characteristic of stable interlayer conduction. SOLUTION: In one multilayer board 10, a through hole 16 passed through an insulating substrate (insulating resin layer 11 plus adhesive layer 13) is made at a position away from a wiring pattern 12; a resin composition 17 is filled in the through hole; and the resin composition 17 forms a positioning projection 18 extruded outwardly from the adhesive layer 13 of the insulating substrate. In the other multilayer board 20, a circular-ring-shaped projection 23 made of a conductive layer for receiving the positioning projection 18 at a position away from a wiring pattern 22 is formed. COPYRIGHT: (C)2005,JPO&NCIPI |
