| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-forming material layer which has low adhesiveness at temperatures near to the ordinary temperature and does not cause adhesion failure due to peeling from a substrate or due to insufficient unevenness followingness, when thermo-compression-bonded, to provide a transfer sheet using the film-forming material layer, to provide a method for producing a dielectric layer-forming substrate, and to provide a dielectric layer-forming substrate. SOLUTION: This film-forming material layer prepared by forming an inorganic powder-containing resin composition comprising inorganic powder and a binder resin in a sheet-like shape is characterized by having a storage elastic modulus (G') of 700,000 to 4,000,000 Pa at 40°C, 2,000 to 40,000 Pa a 100°C. COPYRIGHT: (C)2005,JPO&NCIPI |
