| 摘要 |
The stackable motherboard 10 of the first embodiment includes: a circuit board 12 having a first side 14 and a second side 16 opposite the first side 14, a processor 16 mounted on the circuit board 12, a first peripheral interconnect 18, and a second peripheral interconnect 20. The stackable motherboard 10 also preferably includes: a first motherboard interconnect 22 mounted on the first side 14 of the circuit board 12 and adapted to communicate data between the processor 16 and a first auxiliary motherboard, and a second motherboard interconnect 24 mounted on the second side 16 of the circuit board 12 and adapted to communicate data between the processor 16 and a second auxiliary motherboard.
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