| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase the reliability of a semiconductor device. <P>SOLUTION: The semiconductor device comprises an insulating member 3s which is a chip mounting section whereon a semiconductor chip 1 is mounted, a plurality of terminals 3a arranged in order around the insulating member 3s, insulating resin 3b arranged between adjacent terminals 3a, a plurality of conductive wires 4 for electrically connecting electrodes of the semiconductor chip 1 and the corresponding terminals 3a, and sealing body 6 for resin-sealing the semiconductor chip 1 and the plurality of wires 4. The insulating member 3s which is the chip mounting section and the insulating resin 3b embedded around each terminal 3a are integrally formed together with the same resin. Because no metal plate is arranged in the chip mounting section, the resin is well-balanced on and under the semiconductor chip 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
