发明名称 LASER BEAM MACHINING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device where, even if laser beam machining is continuously performed for a long period of time and the temperature in the case of a condenser is raised, the deviation of the condensing point position of a laser beam irradiated from the condenser is corrected, and the condensing point position can be maintained to the prescribed position of a work. <P>SOLUTION: The laser beam machining device comprises; a work holding means 3 holding a work; a laser beam irradiating means 52 equipped with a condenser 524 with which the work held to the work holding means 3 is irradiated with a laser beam; and a condensing point position controlling means 53 controlling the condensing point position of the laser beam irradiated by the condenser 524. The laser beam machining device is provided with: a temperature detecting means 7 detecting the temperature of the condenser 524; and a controlling means 8 controlling the condensing point position controlling means 53 on the basis of the temperature of the condenser 524 detected by the temperature detecting means 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005088053(A) 申请公布日期 2005.04.07
申请号 JP20030325522 申请日期 2003.09.18
申请人 DISCO ABRASIVE SYST LTD 发明人 NAGAI YUSUKE;KOBAYASHI MASASHI;MORISHIGE YUKIO;SHIGEMATSU KOICHI
分类号 B23K26/04;(IPC1-7):B23K26/04 主分类号 B23K26/04
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