发明名称 SUBSTRATE-PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To move a heater unit and position it accurately, while preventing a substrate-processing device from increasing in cost. SOLUTION: The substrate processing device has a configuration where a base 72 supporting the heater unit 60, a manifold 55, and a processing tube 59 made to undergo reciprocating movement by a heater unit moving device 61 between a thermal treatment performing position and a maintenance operation performing position. A load imposed by the base 72 is supported by a support frame 62 through the intermediary of horizontal slide guides 65. The base 72 is positioned at the support frame 62 by positioning pins 76 and positioning recesses 77. Since maintenance operation, performed for the periphery of the heater unit, can be carried out at a maintenance operation performing position separate from a thermal treatment performing position, the maintenance operation for the periphery of the heater unit can be carried out efficiently. Since the use of a ball spline of large diameter can be avoided, the substrate processing device can be reduced in cost. The substrate processing device can be improved in positioning accuracy by using the positioning pins and positioning recesses. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005093491(A) 申请公布日期 2005.04.07
申请号 JP20030320977 申请日期 2003.09.12
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NAKAGAWA NAOYUKI;ONO SHIGEO
分类号 C23C16/44;H01L21/205;H01L21/22;H01L21/324;(IPC1-7):H01L21/205 主分类号 C23C16/44
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