SNAGAU SOLDER BUMP, METHOD OF MANUFACTURING THE SAME AND METHOD OF BONDING LIGHT EMITTING DEVICE USING METHOD OF MANUFACTURING SOLDER BUMP

摘要

A method for fabricating a SnAgAu solder bump is provided to prevent a driving voltage of a light emitting device from increasing by performing a flip chip bonding process on the light emitting device and a sub mount at a temperature much lower than that of a conventional technique. The first material supply layer is formed on a base substrate(40). A solder bump(56a,58a) made of a two-element based compound is formed on the first material supply layer. The resultant structure having the solder bump is heated. The first material supply layer is composed of a gold layer, a palladium layer, a nickel layer or a sodium layer. The solder bump is made of a compound including SnAg.