| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for a semiconductor device, substrate for semiconductor connection and semiconductor device in which adhesion and heat resistance are improved and foaming does not occur in setting. <P>SOLUTION: In the adhesive sheet for the semiconductor device including an adhesive layer and at least one layer of organic insulating film, a storage modulus E of the adhesive layer before setting is settled within the range of 0.1 to 20MPa in 100°C. As the organic insulating film, a film of a high absorption coefficient such as a polyimide film, for example, is available. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
