SMALL IMAGE PICK-UP MODULE

摘要

PROBLEM TO BE SOLVED: To solve the problem that a manufacturing cost becomes expensive since an image pickup sensor with the large number of pixels and high resolution cannot be loaded and a microwave transmission circuit pattern is directly formed in a case which is made of resin because a fine pattern cannot be formed in a small image pickup module by a conventional MID structure. SOLUTION: The small image pickup module is provided with a case which is formed of resin and a circuit board bonded to a sensor storage of the case. The image pickup sensor is mounted on the circuit board. The circuit board is extended to an outer part from the sensor storage of the case, and an outer connection terminal is obtained. COPYRIGHT: (C)2005,JPO&NCIPI