| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a circuit board having bump electrodes which is improved in connection reliability with respect to a semiconductor element such as a bare chip semiconductor element, efficiently at a low cost. SOLUTION: After forming an insulating protection film 5 on other parts of the surface 2a of a sheet 2 for a substrate than those where electrode terminals 3 are formed, spherical or massive conductive connection members 6 are scattered on the surface 2a of the sheet 2 for a substrate. By applying pressure to the conductive connection members 6 while applying heat to them if necessary, the conductive connection members 6 are bonded to the electrode terminals 3 to form the bump electrodes 4 on the electrode terminals 3. Since the conductive connection members 6 scattered on the insulating protection film 5 are never bonded or attached to the insulating protection film 5 even if applied with pressure, they can be easily removed. COPYRIGHT: (C)2005,JPO&NCIPI |
