| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film wiring layer which is effectively used as a wiring layer for flat display apparatus and can improve moisture-proof property while ensuring wet etching property and heat-proof characteristic. SOLUTION: The thin film wiring layer is formed on a substrate and is formed as an alloy layer including one or two kinds of additive elements of 1 to 10 atom% selected from (Ti, Zr, Hf, V, Nb, Ta, Mo, and W) and a remainder substantially formed of Ni. Preferably, a coating layer includes at least Nb of 1 to 7 atom%, and also includes Mo and/or W in the total amount of 3 to 10 atom% together with Nb. COPYRIGHT: (C)2005,JPO&NCIPI
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