| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor capable of moderating a stress received by a sensor chip due to difference in linear expansion coefficients, and capable of reducing a size. SOLUTION: This semiconductor pressure sensor is provided with the pressure sensor chip 200 having a semiconductor substrate having the first main face and the second main face, a diaphragm 210 provided recessedly on the first main face and having a thin wall part 212 in its bottom face, and a detecting part provided on the second main face to output an electric signal in response to a deflection amount of the diaphragm 210, the first pedestal 1 joined with the first main face; and a second pedestal 2 joined with the second main face, having a recessed part 21 in a position faced to the diaphragm 210, and having wiring 22 provided using a position faced to an electrode as a base end and a micro conductive protrusion 23 provided in a tip of the wiring 22. The semiconductor pressure sensor has a pressure introducing hole 11 communicated with the thin wall part 212 in at least one of the the first pedestal 1 and the second pedestal 2. COPYRIGHT: (C)2005,JPO&NCIPI
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