发明名称 |
Light emitting device assembly |
摘要 |
Provided is a light emitting device assembly. The light emitting device assembly includes a submount including bumps, each having a bonded surface and a lateral surface surrounding the bonded surface; and a light emitting device including pads, each having a bonded surface corresponding to a bonded surface of a corresponding bump. Herein, edges of the bonded surface of each of the bumps are spaced a predetermined distance inward from edges of a corresponding pad.
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申请公布号 |
US2005072984(A1) |
申请公布日期 |
2005.04.07 |
申请号 |
US20040938556 |
申请日期 |
2004.09.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWAK JOON-SEOP;KIM JONG-WAN;CHAE SU-HEE |
分类号 |
H01L21/60;H01L23/48;H01L33/32;H01L33/62;H01L33/64;H01S5/02;H01S5/022;H01S5/323;H05K3/32;(IPC1-7):H01L33/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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