| 摘要 |
MEMS and microelectronic devices and fabrication methods feature providing a first material including a glass, providing a second material having an elastic modulus greater than the elastic modulus of silicon, causing the second material to have a surface with a RMS surface roughness of greater than 0.001 mum and less than approximately 0.15 mum, contacting the surface of the second material to a surface of the first material, and applying a voltage between the first and second materials to cause an anodic bond to form.
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