An apparatus is provided for thermally processing substrates held in a carrier. The apparatus includes a cross-flow liner to improve gas flow uniformity across the surface of each substrate. The cross-flow liner of the present invention includes a longitudinal bulging section to accommodate a cross-flow injection system. The liner is patterned and sized so that it is conformal to the wafer carrier, and as a result, reduces the gap between the liner and the wafer carrier to reduce or eliminate vortices and stagnation in the gap areas between the wafer carrier and the liner inner wall.
申请公布号
WO2005031233(A2)
申请公布日期
2005.04.07
申请号
WO2004US31484
申请日期
2004.09.23
申请人
AVIZA TECHNOLOGY, INC.;DU BOIS, DALE, R.;PORTER, COLE;MOGAARD, MARTIN;BAILEY, JEFF
发明人
DU BOIS, DALE, R.;PORTER, COLE;MOGAARD, MARTIN;BAILEY, JEFF