ADHESIVE AID COMPOSITION

摘要

An adhesive aid composition which has excellent strength of bonding to polyimide films, etc. without lowering mechanical properties and is useful in the field of electrical materials. The adhesive aid composition comprises a polyamide containing phenolic hydroxy groups and a solvent as essential ingredients. The polyamide containing phenolic hydroxy groups preferably is one having segments represented by the following formula (1): (1) (wherein R1 represents a divalent aromatic group and n, indicating the average number of the substituents, is a positive number of 1 to 4). The adhesive aid composition is suitable for use in the bonding of polyimide films.