MEMS STRUCTURE FOR METAL INTERCONNECTION AND FABRICATION METHOD THEREOF

摘要

An MEMS structure for a metal interconnection and a fabrication method thereof are provided to manufacture an MEMS structure having metal wires completely filled by depositing a seed layer. A seed layer is deposited with respect to the entire surface of the upper part of a substrate(100). A metal film is manufactured by plating a first metal on the entire surface of the upper part of the seed layer(120). A predetermined area of the lower part of the seed layer(120) is etched, thereby manufacturing at least one penetration hole. A second metal is plated in at least one penetration hole, thereby manufacturing a metal wiring for electrically connecting to external elements linked with the lower and upper surface of the substrate(100). The seed layer(120) and the metal film are removed.