| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which does not have a core substrate and can easily obtain a wiring board formed by alternately laminating a dielectric layer and a conductive layer composed of polymeric materials, and to provide a wiring board obtained by the method. SOLUTION: A laminated sheet body 10, which is provided with a metal foil contact body 5 composed by tightly adhering two metal foils 5a and 5b, a first dielectric sheet 11 which is closely attached in a surrounding region 21c of the metal foil contact body 5 to a ground surface dielectric layer 21 to seal the metal foil contact body 5, a first conductive layer 31, and a first via conductor 41 formed through the first dielectric sheet 11, is formed on the main surface of the ground surface dielectric layer 21 formed on a support substrate 20 for reinforcement at manufacturing. The peripheral part of a region on the metal foil contact body 5, as a wiring laminated part 100 to be a wiring board, is removed in the laminated sheet body 10. The wiring laminated part 100 is peeled from an interface between two metal foils 5a and 5b, with the metal foil 5b adhered to the wiring laminated part 100. COPYRIGHT: (C)2005,JPO&NCIPI |
