发明名称 METHOD FOR DETECTING STATE OF ELECTROPLATING BATH, AND ELECTROPLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To continuously obtain a satisfactory electroplating film on precise electroplating by detecting a fluctuation in composition of a plating bath on real time and taking a quick measure such as the replenishment of an additive or the like therefor. SOLUTION: On electroplating to an electronic device and a substrate for packaging into the electronic device, electric potential for a reference electrode of a substrate cathode to be plated is detected at a prescribed period in the process of the plating. The situation of the variation in the electric potential is grasped as a vector of featured values. By comparing this with the patterns of the featured values of predetermined variation in electric potential, the pattern closest to the same thereamong is made to indicate, and when it is made close to the pattern classified as abnormality, an alarm is made to emit. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005089841(A) 申请公布日期 2005.04.07
申请号 JP20030326437 申请日期 2003.09.18
申请人 HITACHI LTD;NITTO DENKO CORP 发明人 MURAO KENJI
分类号 C25D21/12;H01L21/288;H05K3/18;(IPC1-7):C25D21/12 主分类号 C25D21/12
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