| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board having heat resistance and moist resistance superior to the conventional ones. SOLUTION: A curable resin composition comprises (1) an epoxy resin which is a diglycidol derivative having a naphthalene structure as a main skeleton, (2) a phenol-novolak resin, a cresol-novolak resin or a bisphenol A-novolak resin, (3) a bismaleimide resin and (4) 2,3-dihydro-1-H-pyrrolo[1,2-a]benzimidazole. The subject curable composite material comprises the curable resin composition and an inorganic filler. The circuit board is obtained by using the curable composite material. The circuit board is preferably a metal-based circuit board, and has 180-200°C maximum allowable working temperature. COPYRIGHT: (C)2005,JPO&NCIPI
|
