发明名称 Nitride semiconductor substrate and method of producing same
摘要 A nitride semiconductor substrate having a rugged surface being lapped by whetting granules to roughness between Rms5 nm and Rms200 nm, which has a function of reducing dislocations of a GaN, InGaN or AlGaN layer epitaxially grown on the lapped substrate by gathering dislocations in the epi-layer to boundaries of holes, pulling the dislocations to bottoms of the holes. Higher roughness of the nitride substrate degrades morphology of an epitaxially-grown layer thereon but reduces dislocation density to a lower level. Morphology of the epi-layer contradicts the dislocation density of the epi-layer. The nitride semiconductor substrate can reduce dislocation density and can be low cost and useful substrates.
申请公布号 US2005073027(A1) 申请公布日期 2005.04.07
申请号 US20040954186 申请日期 2004.10.01
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 IRIKURA MASATO;MOCHIDA YASUSHI;NAKAYAMA MASAHIRO
分类号 C30B29/38;C30B29/40;H01L21/20;H01L21/205;H01L21/304;(IPC1-7):H01L29/221 主分类号 C30B29/38
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