MANUFACTURING METHOD AND PRODUCT OF HIGH POWER TYPE LED

摘要

A method of fabricating a high power type LED and a high power type LED thereby are provided to radiate effectively heat due to high brightness and high power by connecting directly a heat sink to an LED chip and a sub-mount. A heat sink(50) is installed at a lower part of an inside of a main body(20) on which a lead frame(30) is loaded. A soldering paste(63) is coated on a top side of the heat sink and the lead frame. A sub-mount(62) including an LED chip(60) is loaded on the top side of the heat sink. A reflow soldering process is performed to solder the main body on which the sub-mount is loaded. A phosphor is coated on the LED chip. A synthetic resin lens(10) is formed by molding transparent silicon on a top part of the inside of the main body.