| 摘要 |
A PCB(Printed Circuit Board) without an electrolytic plating lead line and a fabrication method thereof are provided to differently carry out a metal finishing process of a wire bonding pad and a solder ball pad, thereby improving line density while reducing a cost. Via holes are processed on a CCL(Copper Clad Laminate). Electroless plating and electrolytic plating layers(404) are formed on both sides of the CCL and inner walls of the via holes. Filling materials(414) are filled in the via holes, and etching resist patterns are formed. When the CCL is soaked in an etching solution, circuit patterns are formed. By removing etching resists, a PCB formed with the circuit patterns is made. Solder resists(406) are applied to both sides of the PCB. Copper clad layers are formed on a surface where a solder ball pad is formed. An insulator is applied to the entire solder ball pad surface. A Ni/Au layer(411) is plated on a surface where a wire bonding pad is formed. If the insulator is delaminated, the Ni/Au layer(411) is plated on the wire bonding pad while the copper clad layers are made on the solder ball pad. The copper clad layers are removed by flash etching. A metal finishing process is applied to a surface of the solder ball pad where the copper clad layers are removed.
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