| 摘要 |
<p>A circuit device is provided to improve the adhesiveness between a semiconductor device and a conductive pattern by using a conductive paste. A circuit device(10A) includes a conductive pattern(12A,12B), A coating resin(14) for coating the conductive pattern except an opening(11A,11B), and a semiconductor device(13A) for contacting electrically the conductive pattern exposed through the opening via a conductive paste(9). The opening is smaller than the semiconductor device. The conductive paste contacts the conductive pattern and the coating resin through the opening. The conductive paste is made of an Ag paste.</p> |
