SEMICONDUCTOR PACKAGE HAVING THERMAL INTERFACE MATERIAL

摘要

A semiconductor package having a thermal interface material is provided to transfer the heat generated from a semiconductor package to a mother board by adhering a heat spreader on a bottom face of a PCB and inserting a thermal interface material between the heat spreader and the mother board. An integrated circuit chip is adhered on an upper surface of a PCB(Printed Circuit Board)(24) in order to be electrically connected to the PCB. An encapsulant(26) is used for encapsulating the integrated circuit chip. An external connection terminal is formed on a bottom face of the PCB. A semiconductor package(20) is mounted on a mother board(30). A heat spreader(31) is adhered on the bottom face of the PCB. A thermal interface material(32) is inserted between the heat spreader and the mother board.