发明名称 RESIN ENCAPSULATION SYSTEM
摘要 In a resin encapsulation system, one or more middle molds remain free without being mechanically connected with an upper mold and a lower mold. The middle mold is circulated, by a middle-mold conveying mechanism, among a molding press, a middle-mold preheating unit, a middle-mold cleaning unit, and an ejecting pressing unit adapted to separate an encapsulated object, a runner, and a gate from the middle mold. Resin encapsulation molding is performed in the circulating process described above.
申请公布号 KR100480517(B1) 申请公布日期 2005.04.06
申请号 KR20020025488 申请日期 2002.05.09
申请人 发明人
分类号 B29C45/26;H01L21/56;B29C45/02;B29C45/14;B29L31/34;H01L21/00;(IPC1-7):H01L21/56 主分类号 B29C45/26
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