| 摘要 |
A polishing head of a wafer polishing apparatus is provided to improve the flatness of a wafer and to obtain an aiming thickness from the wafer by controlling the pressure applied to the wafer according to corresponding portions. A polishing head(20) of a wafer polishing apparatus includes a head body, pressurizing parts, an air pressure correcting part, a contact plate, and a support part. The head body(21) includes a plurality of air pressure supply ports(31,35). The air pressure supply ports are capable of controlling discretely the pressure of each portion of the polishing head by supplying compressed air. The pressurizing parts(25,27) are installed under the head body corresponding to the air pressure supply ports in order to press a wafer(W). The air pressure correcting part is installed under each pressurizing part to control the pressure discrepancy between the pressurizing parts. The contact plate(23) is installed under the air pressure correcting part to contact and press the wafer, directly. The support part is used for connecting and supporting the head body, the pressurizing parts, the air pressure correcting part and the contact plate.
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