| 摘要 |
A piezoelectric part which can be reduced in size, and further which has improved degree of freedom regarding the position of external terminals, and a manufacturing method thereof, are provided. A surface acoustic wave device comprises a SAW element 6 having an IDT 2 formed on a piezoelectric substrate and electroconductive pads 3 connected to the IDT 2, and a bonding board 20 having electroconductive pad through holes 18, bonded by an adhesive layer 21, so as to face the IDT 2. Protective space is formed by an excitation portion protecting hollow structure 16 for protecting surface acoustic wave excitation portion such as the IDT 2 is formed. Also, external terminals 22 connected to the electroconductive pads 3 through the electroconductive pad through holes 18 are at positions offset from the electroconductive pad through holes 18. <IMAGE> |
