| 摘要 |
A ZnO-based light emitting device and a method of manufacturing the same are provided to enhance bonding efficiency and productivity in a packaging process by improving characteristics of a p-type clad layer and an ohmic contact layer. A light emitting device using a zinc oxide includes an n-type clad layer and a p-type clad layer(40). A first ohmic contact layer(50) is formed on an upper surface of the p-type clad layer. The first ohmic contact layer is formed with a compound of one selected from a first material group including copper oxide and indium oxide and an additive. The first ohmic contact layer includes one or more of Fe, Cr, Co, Rh, La, Ag, Ni, Zn, Pd, Mg, Li, Nd, Eu, and V, or one or more of a second material group including compounds thereof, and the copper oxide. |
