发明名称 |
Two-layer copper polyimide substrate |
摘要 |
A two-layer copper polyimide substrate includes a modified layer on the surface of a polyimide film having a thickness of not more than 200 Å, and preferably not less than 50 Å, as evaluated by a method by dyeing a section thereof with a silver nitrate aqueous solution and observing it by a transmission electron microscope (TEM). A metal seed layer is formed on the polyimide film surface, followed by forming a copper layer thereon by copper electroplating or copper electroless plating or a combination of the both, providing a two-layer copper polyimide substrate in which any of an initial adhesion, a heat resistant adhesion after standing in air at 150° C. for 168 hours, and a PCT adhesion after PCT test at 121° C. and at a humidity of 95% under 2 atmospheres for 100 hours are 400 N/m or more.
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申请公布号 |
US6875519(B2) |
申请公布日期 |
2005.04.05 |
申请号 |
US20030443145 |
申请日期 |
2003.05.22 |
申请人 |
SUMITOMO METAL MINING CO., LTD. |
发明人 |
SAEKI NORIYUKI;SAKOU TAKEFUMI;WATANABE HIROTO;ISHII YOSHIRO |
分类号 |
B32B15/088;H05K1/03;H05K3/00;H05K3/38;(IPC1-7):B32B9/04;C23C28/02;C25D5/16 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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