Conductive clip for a semiconductor package,申请号US20030188754F-传众专利搜索

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发明名称	Conductive clip for a semiconductor package
摘要
申请公布号	USD503691(S1)	申请公布日期	2005.04.05
申请号	US20030188754F	申请日期	2003.08.22
申请人	INTERNATIONAL RECTIFIER CORPORATION	发明人	STANDING MARTIN;SCHOFIELD HAZEL DEBORAH
分类号		主分类号
代理机构		代理人
主权项
地址

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