发明名称 Electronic component mounting apparatus
摘要 In this electronic component mounting apparatus, a mounting head is movably arranged between the electronic component supplying unit and the board holding unit. A first camera for taking an image of the board in the board holding unit and detecting an electronic component mounting position, and a second camera for taking images of the chips of the electronic component supplying unit are arranged in such a manner that the first camera and the second camera can be entered/evacuated as against the electronic component supplying unit. Therefore, the electronic component supplying unit and the board holding unit are defined as a range to be transported, and the mounting head, the first camera, and the second camera are relatively traveled in conjunction to each other, a loss-time in both the electronic component supplying unit and the board holding unit can be avoided, and tact time can be shortened to improve a work-efficiency.
申请公布号 US6874225(B2) 申请公布日期 2005.04.05
申请号 US20020316348 申请日期 2002.12.11
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HAJI HIROSHI;HIDESE WATARU
分类号 H01L23/48;H01L21/00;(IPC1-7):B23P19/00 主分类号 H01L23/48
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