发明名称 |
Method for packaging an image sensor |
摘要 |
A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.
|
申请公布号 |
US6874227(B2) |
申请公布日期 |
2005.04.05 |
申请号 |
US20030454649 |
申请日期 |
2003.06.03 |
申请人 |
KINGPAK TECHNOLOGY INC. |
发明人 |
HSIN CHUNG HSIEN;TU HSIU-WEN;CHUANG JASON;YOU IRVING |
分类号 |
G01R1/00;H01L27/146;H05K3/30;(IPC1-7):H05K3/30 |
主分类号 |
G01R1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|