发明名称 Thin film capacitor and method for fabricating the same
摘要 A thin film capacitor including a first electrode structural body, a second electrode structural body and a dielectric thin film provided between the first and second electrode structural bodies and containing a bismuth layer structured compound. The surface of the first electrode structural body in contact with the dielectric thin film is oriented in the [001] direction. As a result, the dielectric thin film is naturally oriented so that its c axis is substantially perpendicular to the electrode structural bodies. When a voltage is applied between the first and second electrode structural bodies, since the direction of the electric field substantially coincides with the c axis of the bismuth layer structured compound, the bismuth layer structured compound can be prevented from exhibiting the ferroelectric property and made to sufficiently exhibit the paraelectric property. Further, a bismuth oxide layer (Bi2O2)<2+> functions as an insulating layer, thereby improves the insulation property of the dielectric thin film while makes the thin film much thinner.
申请公布号 US6876536(B2) 申请公布日期 2005.04.05
申请号 US20020331140 申请日期 2002.12.27
申请人 TDK CORPORATION 发明人 SAKASHITA YUKIO;CHOI KYUNG-KU
分类号 H01G4/10;H01G4/12;H01G4/228;H01G4/32;H01G4/33;H01L21/02;H01L27/01;H01L29/76;(IPC1-7):H01G4/32 主分类号 H01G4/10
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