发明名称 Method for manufacturing printed circuit board
摘要 A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.
申请公布号 US6874675(B2) 申请公布日期 2005.04.05
申请号 US20030616194 申请日期 2003.07.09
申请人 LIEM SAMUEL KENNETH;MEC COMPANY LTD. 发明人 KIDA TETSUO;LIEM SAMUEL KENNETH
分类号 C23G1/00;H05K3/26;H05K3/34;(IPC1-7):B23K1/20 主分类号 C23G1/00
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