发明名称 |
Semiconductor chip and method for producing housing |
摘要 |
A selective encapsulation is produced which covers the connection pads and bonding wires with a potting compound and leaves free active regions, in particular a bearing area for a finger in a fingerprint sensor, by the chip surface being selectively adapted by different roughness or coating and/or the viscosity of the potting compound being altered by irradiation thereof.
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申请公布号 |
US6876090(B2) |
申请公布日期 |
2005.04.05 |
申请号 |
US20030649410 |
申请日期 |
2003.08.27 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
MENSCH HANS-GEORG;SPOETTL THOMAS |
分类号 |
H01L23/28;G06K9/00;H01L21/56;H01L23/31;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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