| 摘要 |
Provided is a thermally conductive pressure sensitive adhesive tape to be provided between the heating source and the heat sink of an electronic part which is excellent in adhesion maintenance at a high temperature and has a high thermal conductivity, thereby exhibiting an effective heat radiating performance. The thermally conductive pressure sensitive adhesive tape comprises 1-20 parts by weight of an acryl monomer; 80-99 parts by weight of an acryl oligomer; 0.005-2 parts by weight of a reaction initiator; 50-200 parts by weight of a thermally conductive filler; and 5-50 parts by weight of a plasticizer. Preferably the thermally conductive filler is at least one selected from the group consisting of silica, boron nitride, silicon nitride, titanium dioxide, magnesium oxide, zinc oxide, nickel oxide, copper oxide, aluminum oxide, iron oxide, magnesium hydroxide and aluminum hydroxide. |
