发明名称 TEMPERATURE CONTROLLING SYSTEM OF HEAT PLATE FOR MULTI-LAYER HOT PRESS
摘要 A hot plate temperature control system and a method for a multi-layer hot press are provided to improve productivity and to improve quality of a PCB(Printed Circuit Board) produced, by removing a temperature variation of hot plates in a high-temperature state. A multi-layer hot press(50) comprises a pressing unit arranged to the upper part of a base to press a lower bed; vertical frames set up to the sides of the vase; an upper bed horizontally installed to the upper part of the vertical frames; and hot plates(56,57) for pressing a PCB in a high-temperature and high-pressure state between the lower bed and the upper bed and completing the PCB. A hot plate temperature control system for the multi-layer hot press has a temperature control unit keeping the temperature of the hot plates high without a temperature variation. The temperature control unit comprises electric heaters(61) installed to the center of the hot plates to raise the temperature in a high temperature state; thermal oil lines(62,63) installed to the upper and lower sides of the electric heaters to reduce the temperature variation; and a circulation unit(65) installed to the thermal oil lines to reduce the temperature variation of the hot plates or cool the hot plates by continuously circulating thermal oil.
申请公布号 KR20050031100(A) 申请公布日期 2005.04.01
申请号 KR20050020636 申请日期 2005.03.11
申请人 KUM, BYEONG CHUL 发明人 KUM, BYEONG CHUL
分类号 B30B15/34;(IPC1-7):B30B15/34 主分类号 B30B15/34
代理机构 代理人
主权项
地址