CONTROLLING METHOD, TEMPERATURE CONTROLLING METHOD, THERMOREGULATOR, AND THERMAL TREATING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To suppress scattering of physical condition, such as temperature or the like at transience. SOLUTION: The controlling method suppresses scattering of temperature of a heat treating board at time of t, using interference by this pre-heating, in such a manner that the pre-heating is executed by adding step input into a target temperature before a semiconductor wafer has been mounted, in order to suppress scattering of the temperature of the heat treating board at time t, after heat treatment has been started by mounting the semiconductor wafer on the heat treatment board. COPYRIGHT: (C)2005,JPO&NCIPI