发明名称 Semiconductor device and method for fabricating the same
摘要 A semiconductor device includes a semiconductor substrate of a first conductive type, a collector layer formed on the semiconductor substrate and made of a first semiconductor being of the first conductive type and having a higher resistance than that of the semiconductor substrate, an intrinsic base region having a junction surface with the collector layer and made of a second semiconductor of a second conductive type, and an emitter region having a junction surface with the intrinsic base region and made of a third semiconductor of the first conductive type. A periphery of the intrinsic base region is surrounded by an insulating region extending from the collector layer to the semiconductor substrate.
申请公布号 US2005067672(A1) 申请公布日期 2005.03.31
申请号 US20040948264 申请日期 2004.09.24
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TOYODA YASUYUKI;SONETAKA SHINICHI
分类号 H01L21/331;H01L21/8222;H01L27/082;H01L29/06;H01L29/08;H01L29/10;H01L29/417;H01L29/423;H01L29/732;(IPC1-7):H01L27/102 主分类号 H01L21/331
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