发明名称 |
Semiconductor device and method for fabricating the same |
摘要 |
A semiconductor device includes a semiconductor substrate of a first conductive type, a collector layer formed on the semiconductor substrate and made of a first semiconductor being of the first conductive type and having a higher resistance than that of the semiconductor substrate, an intrinsic base region having a junction surface with the collector layer and made of a second semiconductor of a second conductive type, and an emitter region having a junction surface with the intrinsic base region and made of a third semiconductor of the first conductive type. A periphery of the intrinsic base region is surrounded by an insulating region extending from the collector layer to the semiconductor substrate.
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申请公布号 |
US2005067672(A1) |
申请公布日期 |
2005.03.31 |
申请号 |
US20040948264 |
申请日期 |
2004.09.24 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TOYODA YASUYUKI;SONETAKA SHINICHI |
分类号 |
H01L21/331;H01L21/8222;H01L27/082;H01L29/06;H01L29/08;H01L29/10;H01L29/417;H01L29/423;H01L29/732;(IPC1-7):H01L27/102 |
主分类号 |
H01L21/331 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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